Wafer-Level Inspection
Trooper-V
SiC & GaN Wafer-Level AOI Handler
Trooper-V is Pentamaster's next level high speed AOI
handler designed for wafer-level packages. With quality objective lens, it allows for different levels of
magnification to accommodate various types & sizes of dies.
It is available in 2 different designs depending on our customer's requirements, one which allows it to operate in cleanrooms (Class 1000) and the other which is operate-able in standard production floors.
| Raw Wafer (6”, 8”, 12”), Mylar Wafer Ring (6”, 8”, 12”) | |
| Silicon Carbide (SiC), Gallium Nitride (GaN), CMOS Image Sensor, Flip Chip, Die | |
| Pre-Wafer Alignment, Die Surface Inspection, Probe Mark Inspection, Wafer Saw Line Inspection [Optional], Final Verification | |
|
Camera High resolutions color camera Lens Magnification Capabilities1.0x, 2.0x, 3.0x, 5.0x, 7.5x, 10.0x IlluminationLight Source with RGB configuration Short-Wave Infrared (SWIR) Imaging TechnologyBottom Camera Optional |
ZAN-X 2000
Advanced Wafer AOI System
ZANX 2000 is an advanced automated wafer inspection system
engineered for high-resolution detection of both micro and macro surface defects on Bare Wafers and Film Frame
Wafers.
|
Bare wafer (6", 8", 12") Wafer Thickness: 100um~1000um Film frame wafer (6", 8", 12") |
|||||||||||||||||||
| FOUP/FOSB, Open Cassette, Metal Cassette | |||||||||||||||||||
|